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Services

MicroSil offers standard and custom wafer processing to provide the most cost-effective solutions for our customers. 
MicroSil is a full-service silicon wafer reclaim facility incorporated in Boise, Idaho in 1994.  The company was founded by engineers having extensive prior experience in semiconductor fabrication and related manufacturing.  MicroSil has developed a number of proprietary processes and specializes in offering a variety of services to support individual needs:

  • Silicon surface restoration for wafer sizes between 50mm and 300mm.

  • Full reclaim

    • Polishing services for prime, test grade, and mechanical test wafers.

  • Recycle

    • Reclaim for film deposition and monitor wafers.

  • IC process thin films removal and polishing.

  • Double side polishing.

  • Laser scanning services.

  • Specialty and custom processing.

  • Small orders accepted.

  • Direct wafer sales.

  • Close customer support.

  • Sample wafer processing.

  • Precison waterjet cutting services.

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